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R329

Intelligent Voice Dedicated SoC

Product

Block Diagram

R329

Features

CPU

• Dual-core ARM Cortex™-A53@1.5GHz
• 32KB L1 I-cache + 32KB L1 D-cache per core
• 256KB L2 cache

DSP

• Dual-core HiFi4@400MHz
• 32KB L1 I-cache + 32KB L1 D-cache per core
• 2MB SRAM

NPU

• Arm China Zhouyi Z1 AIPU, 1TEC+128mac FF
• 0.25TOPS@800MHz

OS

• Linux 4.9

Process

• 28nm HPC+

Memory

• Embedded DDR3 128MB
• Supports SPI Nand/Nor/eMMC

Audio

• Supports 5 audio ADC and 2 audio DAC
• Supports 5 analog audio inputs and 2 analog audio output
• Up to 3 I2S/PCM controllers for Bluetooth and external audio codec
• Integrated digital microphone, supports maximum 8 digital microphones

Security Engine

• Supports Symmetrical algorithm: AES, DES, 3DES
• Supports Hash algorithm: MD5, SHA, HMAC
• Supports Pubic Key algorithm: RSA
• Supports 160-bit hardware PRNG with 175-bit seed
• Supports 256-bit hardware TRNG
• Supports 1K-bit EFUSE for chip ID and security application

Connectivity

• USB 2.0 OTG x 1, USB HOST x 1
• SDIO 3.0 x 2
• LEDC, PWM x 15
• IR TX, IR RX
• TWI x 3, SPI x 2, UART x 5
• LRADC , GPADC x 4
• GMAC, SCR

WIFI&BT

• XR829 or others

Package

• BGA231 12mm x 12mm

Highlights

Dual ARM Cortex™-A53
Dual ARM Cortex™-A53
Dedicated AI processors:Zhouyi AIPU, HiFi4 DSP
Dedicated AI processors:Zhouyi AIPU, HiFi4 DSP
Three Stages Wakeup Model
Three Stages Wakeup Model
Higher Intergration:5 x ADC、2 x DAC、8 x DMIC
Higher Intergration:5 x ADC、2 x DAC、8 x DMIC
28nm process, BGA 12mm x 12mm package
28nm process, BGA 12mm x 12mm package
Industrial standard
Industrial standard

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R329

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